1.缺件(MISSING PARTS) 28.脚未弯(PIN NOT BENT) 55.印章错误(WRONG STAMPS)
2.错件(WRONG PARTS) 29.缺盖章(MISSING STAMP) 56.尺寸错误(DIMENSION WRONG)
3.多件(EXCESSIVE PARTS) 30.缺标签(MISSING LABEL) 57.二极体坏(DIODE NG)
4.短路(SHORT) 31.缺序号(MISSING S/N) 58.电晶体坏(TRANSISTOR NG)
5.断路(OPEN) 32.序号错(WRONG S/N) 59.振荡器坏(X’TL NG)
6.线短(WIRE SHORT) 33.标签错(WRONG LABEL) 60.管装错误(TUBES WRONG)
7.线长(WIRE LONG) 34.标示错(WRONG MARK) 61.阻值错误(IMPEDANCE WRONG)
8.拐线(WIRE POOR DDRESS) 35.脚太短(PIN SHORT) 62.版本错误(REV WRONG)
9.冷焊(COLD SOLDER) 36.J1不洁(J1 DIRTY) 63.电测不良(TEST FAILURE)
10.包焊(EXCESS SOLDER) 37.锡凹陷(SOLDER SCOOPED) 64.版本未标(NON REV LEBEL)
11.空焊(MISSING SOLDER) 38.线序错(W/L OF WIRE) 65.包装损坏(PACKING DAMAGED)
12.锡尖(SOLDER ICICLE) 39.未测试(NO TEST) 66.印章模糊(STAMPS DEFECTIVE)
13.锡渣(SOLDER SPLASH) 40.VR变形(VR DEFORMED) 67.标签歪斜(LABEL TILT)
14.锡裂(SODER CRACK) 41.PCB翘皮(PCB PEELING) 68.外箱损坏(CARTON DAMAGED)
15.锡洞(PIN HOLE) 42.PCB弯曲(PCB TWIST) 69.点胶不良(POOR GLUE)
16.锡球(SOLDER BALL) 43.零件沾胶(GLUE ON PARTS) 70.IC座氧化(SOCKET RUST)
17.锡桥(SOLDER BRIDGE) 44.零件脚长(PARTS PIN LONG) 71.缺UL标签(MISSING UL LABEL)
18.滑牙(SCREW LOOSE) 45.浮件(PARTS LIFT) 72.线材不良(WIRE FAILURE)
19.氧化(RUST) 46.零件歪斜(PARTS TILT) 73.零件脚损坏(PIN DAMAGED)
20.异物(FOREIGNER MATERIAL) 47.零件相触(PARTS TOUCH) 74.金手指沾锡(SOLDER ON GOLDEN FINGERS)
21.溢胶(EXCESSIVE GLUE) 48.零件变形(PARTS DEFORMED) 75.包装文件错(RACKING DOC WRONG)
22.锡短路(SOLDER BRIDGE) 49.零件损坏(PARTS DAMAGED) 76.包装数量错(PACKING Q’TY WRONG)
23.锡不足(SOLDER INSUFFICIENT) 50.零件脚脏(PIN DIRTY) 77.零件未定位(PARTS UNSEATED)
24.极性反(WRONG POLARITY) 51.零件多装(PARTS EXCESS) 78.金手指沾胶(GLUE ON GOLDEN FINGERS)
25.脚未入(PIN UNSEATED) 52.零件沾锡(SOLDER ON PARTS) 79.垫片安装不良(WASHER UNSEATED)
26.脚未出(PIN UNVISIBLE) 53.零件偏移(PARTS SHIFT) 80.线材安装不良(WIRE UNSEATED)
27.脚未剪(PIN NO CUT) 54.包装错误(WRONG PACKING) 81. 立碑(TOMBSTONE)
2.错件(WRONG PARTS) 29.缺盖章(MISSING STAMP) 56.尺寸错误(DIMENSION WRONG)
3.多件(EXCESSIVE PARTS) 30.缺标签(MISSING LABEL) 57.二极体坏(DIODE NG)
4.短路(SHORT) 31.缺序号(MISSING S/N) 58.电晶体坏(TRANSISTOR NG)
5.断路(OPEN) 32.序号错(WRONG S/N) 59.振荡器坏(X’TL NG)
6.线短(WIRE SHORT) 33.标签错(WRONG LABEL) 60.管装错误(TUBES WRONG)
7.线长(WIRE LONG) 34.标示错(WRONG MARK) 61.阻值错误(IMPEDANCE WRONG)
8.拐线(WIRE POOR DDRESS) 35.脚太短(PIN SHORT) 62.版本错误(REV WRONG)
9.冷焊(COLD SOLDER) 36.J1不洁(J1 DIRTY) 63.电测不良(TEST FAILURE)
10.包焊(EXCESS SOLDER) 37.锡凹陷(SOLDER SCOOPED) 64.版本未标(NON REV LEBEL)
11.空焊(MISSING SOLDER) 38.线序错(W/L OF WIRE) 65.包装损坏(PACKING DAMAGED)
12.锡尖(SOLDER ICICLE) 39.未测试(NO TEST) 66.印章模糊(STAMPS DEFECTIVE)
13.锡渣(SOLDER SPLASH) 40.VR变形(VR DEFORMED) 67.标签歪斜(LABEL TILT)
14.锡裂(SODER CRACK) 41.PCB翘皮(PCB PEELING) 68.外箱损坏(CARTON DAMAGED)
15.锡洞(PIN HOLE) 42.PCB弯曲(PCB TWIST) 69.点胶不良(POOR GLUE)
16.锡球(SOLDER BALL) 43.零件沾胶(GLUE ON PARTS) 70.IC座氧化(SOCKET RUST)
17.锡桥(SOLDER BRIDGE) 44.零件脚长(PARTS PIN LONG) 71.缺UL标签(MISSING UL LABEL)
18.滑牙(SCREW LOOSE) 45.浮件(PARTS LIFT) 72.线材不良(WIRE FAILURE)
19.氧化(RUST) 46.零件歪斜(PARTS TILT) 73.零件脚损坏(PIN DAMAGED)
20.异物(FOREIGNER MATERIAL) 47.零件相触(PARTS TOUCH) 74.金手指沾锡(SOLDER ON GOLDEN FINGERS)
21.溢胶(EXCESSIVE GLUE) 48.零件变形(PARTS DEFORMED) 75.包装文件错(RACKING DOC WRONG)
22.锡短路(SOLDER BRIDGE) 49.零件损坏(PARTS DAMAGED) 76.包装数量错(PACKING Q’TY WRONG)
23.锡不足(SOLDER INSUFFICIENT) 50.零件脚脏(PIN DIRTY) 77.零件未定位(PARTS UNSEATED)
24.极性反(WRONG POLARITY) 51.零件多装(PARTS EXCESS) 78.金手指沾胶(GLUE ON GOLDEN FINGERS)
25.脚未入(PIN UNSEATED) 52.零件沾锡(SOLDER ON PARTS) 79.垫片安装不良(WASHER UNSEATED)
26.脚未出(PIN UNVISIBLE) 53.零件偏移(PARTS SHIFT) 80.线材安装不良(WIRE UNSEATED)
27.脚未剪(PIN NO CUT) 54.包装错误(WRONG PACKING) 81. 立碑(TOMBSTONE)
